| PART |
Description |
Maker |
| 87874-3002 0878743002 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
| 70287-1001 0702871001 SD-70287-004 |
2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 0942422318 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole, PCT, Vertical, 18 Circuit, White
MOLEX Connector
|
Molex Electronics Ltd.
|
| 71764-0006 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
| 85013-3093 0850133093 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 87911-5411 0879115411 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0022122264 22-12-2264 |
2.54mm (.100) Pitch KK庐 Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51渭m (20渭) Gold (Au) Plating
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51μm (20μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0022122114 22-12-2114 A-7478-11A501 |
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 11 Circuits, 0.51μm (20μ) Gold (Au) Plating
2.54mm (.100) Pitch KK垄莽 Solid Header, Right Angle, with Friction Lock, 11 Circuits, 0.51楼矛m (20楼矛) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0022122124 22-12-2124 A-7478-12A501 |
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 12 Circuits, 0.51μm (20μ) Gold (Au) Plating
2.54mm (.100) Pitch KK垄莽 Solid Header, Right Angle, with Friction Lock, 12 Circuits, 0.51楼矛m (20楼矛) Gold (Au) Plating
|
Molex Electronics Ltd.
|
|
